Dây kim cương siêu mỏng để cắt lát tấm silicon

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June 28, 2025
Category Connection: Cắt cưa dây
Brief: Discover the Precision Ultra-Thin Diamond Wire, a cutting-edge tool for slicing silicon wafers in semiconductor and PV industries. With ultra-thin diameter and high precision, it ensures minimal material loss and superior surface quality. Perfect for advanced packaging and solar cell production.
Related Product Features:
  • Ultra-thin diameter (30-100 μm) minimizes kerf loss and increases wafer yield.
  • High precision cutting ensures uniform wafer thickness (100-200 μm) with superior surface quality.
  • Diamond abrasives (5-30 μm) provide exceptional hardness and wear resistance.
  • High tensile core (steel or tungsten) ensures durability and breakage resistance during high-speed cutting.
  • Low wire vibration enhances cutting stability, reducing surface defects like micro-cracks.
  • Faster cutting speeds (1.5-2.5 m/s) compared to slurry-based multi-wire sawing.
  • Reduces material waste with kerf loss as low as ~100 μm.
  • Eco-friendly solution eliminating slurry waste and lowering environmental impact.
CÂU HỎI THƯỜNG GẶP:
  • What industries benefit from the Precision Ultra-Thin Diamond Wire?
    The semiconductor and photovoltaic (PV) industries benefit the most, especially for slicing silicon wafers for ICs, MEMS, power devices, and solar panels.
  • How does the diamond wire reduce material waste?
    The ultra-thin diameter (30-100 μm) and precision cutting reduce kerf loss to ~100 μm, significantly lowering silicon waste compared to traditional slurry saws.
  • What are the advantages of using diamond abrasives?
    Diamond abrasives (5-30 μm) offer exceptional hardness and wear resistance, ensuring long-lasting performance and high-efficiency cutting.